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BYV29B-600 recti?er diode ultrafast rev. 01 11 august 2003 product data m3d166 1. product pro?le 1.1 description ultra-fast, epitaxial recti?er diode in a surface mount plastic package. product availability: BYV29B-600 in sot404 (d 2 -pak). 1.2 features 1.3 applications 1.4 quick reference data 2. pinning information [1] it is not possible to make connection to pin 2 of the sot404 package. n low forward voltage n fast switching n soft recovery characteristic n high thermal cycling performance. n switched-mode power supplies n low loss recti?cation. n v r 600 v n v f 1.03 v n i f(av) 9a n t rr 60 ns table 1: pinning - sot404 (d 2 -pak), simpli?ed outline and symbol pin description simpli?ed outline symbol 1 no connection sot404 (d 2 -pak) 2 cathode (k) [1] 3 anode (a) mb mounting base; connected to cathode (k) 13 2 mbk116 mb ka 001aaa020
philips semiconductors BYV29B-600 recti?er diode ultrafast product data rev. 01 11 august 2003 2 of 12 9397 750 11884 ? koninklijke philips electronics n.v. 2003. all rights reserved. 3. ordering information 4. limiting values [1] neglecting switching and reverse current losses. table 2: ordering information type number package name description version BYV29B-600 d 2 -pak plastic single-ended surface mounted package; 3 leads (one lead cropped) sot404 table 3: limiting values in accordance with the absolute maximum rating system (iec 60134). symbol parameter conditions min max unit v rrm repetitive peak reverse voltage - 600 v v rwm crest working reverse voltage - 600 v v r reverse voltage - 600 v i f(av) average forward current square wave; d = 0.5; t mb 120 c [1] -9a i frm repetitive peak forward current square wave; t = 25 m s; d = 0.5; t mb 120 c -18a i fsm non-repetitive peak forward current sinusoidal; with reapplied v rrm(max) t p =10ms - 70 a t p = 8.3 ms - 77 a t stg storage temperature - 40 + 150 c t j junction temperature - +150 c
philips semiconductors BYV29B-600 recti?er diode ultrafast product data rev. 01 11 august 2003 3 of 12 9397 750 11884 ? koninklijke philips electronics n.v. 2003. all rights reserved. square current waveform sinusoidal current waveform fig 1. maximum forward power dissipation (square current waveform) as a function of average forward current. fig 2. maximum forward power dissipation (sinusoidal current waveform) as a function of average forward current. 12 150 137.5 125 112.5 16 8 4 0 0 20 5 10 15 t mb(max) 100 ( c) p f (w) i f(av) (a) t p t p t p t t d = d = 1 d = 0.5 d = 0.2 d = 0.1 003aaa446 0 4 8 12 16 12 150 140 130 120 110 20 8 4 0 p f (w) t mb(max) ( c) 100 i f(av) (a) 4 2.8 2.2 1.9 a = 1.57 003aaa447 i fav () i frms () d = a i frms () i fav () ------------------- =
philips semiconductors BYV29B-600 recti?er diode ultrafast product data rev. 01 11 august 2003 4 of 12 9397 750 11884 ? koninklijke philips electronics n.v. 2003. all rights reserved. 5. thermal characteristics 5.1 transient thermal impedance table 4: thermal characteristics symbol parameter conditions min typ max unit r th(j-mb) thermal resistance from junction to mounting base figure 3 - - 2.5 k/w r th(j-a) thermal resistance from junction to ambient in free air - 50 - k/w fig 3. transient thermal impedance from junction to mounting base as a function of pulse duration. 1 10 t p (s) z th(j-mb) (k/w) 10 - 1 10 - 2 10 - 3 10 1 10 - 1 10 - 2 10 - 3 10 - 4 10 - 5 10 - 6 003aaa453 t p p t
philips semiconductors BYV29B-600 recti?er diode ultrafast product data rev. 01 11 august 2003 5 of 12 9397 750 11884 ? koninklijke philips electronics n.v. 2003. all rights reserved. 6. characteristics table 5: characteristics t j =25 c unless otherwise speci?ed. symbol parameter conditions min typ max unit static characteristics v f forward voltage i f =8a t j = 150 c; figure 4 - 0.9 1.03 v t j =25 c; figure 4 - 1.05 1.25 v i f = 20 a - 1.3 1.45 v i r reverse current v r =v rrm t j = 100 c - 0.1 0.35 ma t j =25 c-250 m a dynamic characteristics c d diode capacitance f = 1 mhz; v r = 100 v; figure 8 -7-pf q rr reverse recovery charge i f = 2 a; v r 3 30 v; di f /dt = 20 a/ m s; figure 7 -4070nc t rr reverse recovery time i f = 1 a; v r 3 30 v; di f /dt = 100 a/ m s; figure 5 -5060ns i rrm peak reverse recovery current i f = 10 a; v r 3 30 v; di f /dt=50a/ m s t j = 100 c; figure 6 - 3 5.5 a v fr forward recovery voltage i f = 10 a; di f /dt=10a/ m s - 3.2 - v
philips semiconductors BYV29B-600 recti?er diode ultrafast product data rev. 01 11 august 2003 6 of 12 9397 750 11884 ? koninklijke philips electronics n.v. 2003. all rights reserved. fig 4. forward current as a function of forward voltage; typical values. fig 5. maximum reverse recovery time as a function of rate of change of forward current. fig 6. reverse current as a function of rate of change of forward current; typical values. fig 7. maximum reverse recovery charge as a function of rate of change of forward current. 0 typ max v f (v) 0.4 0.8 1.2 1.6 2 0 8 16 24 36 i f (a) t j = 150 c t j = 25 c 003aaa450 10 10 2 10 3 t rr (ns) i f = 10 a i f = 1 a 10 10 2 t j = 25 c t j = 150 c -di f /d t (a/ m s) 003aaa448 1 10 10 2 -di f /d t (a/ m s) i f = 1 a i f = 10 a t j = 25 c 10 1 10 -1 10 -2 i rrm (a) t j = 100 c 003aaa449 q rr 1 10 10 2 10 3 i f = 10 a (nc) 1 10 10 2 -di f /d t (a/ m s) i f = 2 a 003aaa452 25 c 150 c
philips semiconductors BYV29B-600 recti?er diode ultrafast product data rev. 01 11 august 2003 7 of 12 9397 750 11884 ? koninklijke philips electronics n.v. 2003. all rights reserved. f = 1mhz fig 8. diode capacitance as a function of reverse voltage; typical values. 1 10 10 2 c d (pf) v r (v) 1 10 10 2 10 3 003aaa451
philips semiconductors BYV29B-600 recti?er diode ultrafast product data rev. 01 11 august 2003 8 of 12 9397 750 11884 ? koninklijke philips electronics n.v. 2003. all rights reserved. 7. package outline fig 9. sot404 (d 2 -pak). unit a references outline version european projection issue date iec jedec eiaj mm a 1 d 1 d max. e el p h d q c 2.54 2.60 2.20 15.80 14.80 2.90 2.10 11 1.60 1.20 10.30 9.70 4.50 4.10 1.40 1.27 0.85 0.60 0.64 0.46 b dimensions (mm are the original dimensions) sot404 0 2.5 5 mm scale plastic single-ended surface mounted package (philips version of d 2 -pak); 3 leads (one lead cropped) sot404 e e e b d 1 h d d q l p c a 1 a 13 2 mounting base 99-06-25 01-02-12
philips semiconductors BYV29B-600 recti?er diode ultrafast product data rev. 01 11 august 2003 9 of 12 9397 750 11884 ? koninklijke philips electronics n.v. 2003. all rights reserved. 8. soldering dimensions in mm. fig 10. re?ow soldering footprint for sot404. handbook, full pagewidth msd057 solder lands solder resist occupied area solder paste 10.50 7.40 7.50 1.50 1.70 10.60 1.20 1.30 1.55 5.08 10.85 0.30 2.15 8.35 2.25 4.60 0.20 3.00 4.85 7.95 8.15 8.075 8.275 5.40 1.50
philips semiconductors BYV29B-600 recti?er diode ultrafast product data rev. 01 11 august 2003 10 of 12 9397 750 11884 ? koninklijke philips electronics n.v. 2003. all rights reserved. 9. revision history table 6: revision history rev date cpcn description 01 20030811 - product data (9397 750 11884).
9397 750 11884 philips semiconductors BYV29B-600 recti?er diode ultrafast ? koninklijke philips electronics n.v. 2003. all rights reserved. product data rev. 01 11 august 2003 11 of 12 9397 750 11884 philips semiconductors BYV29B-600 recti?er diode ultrafast ? koninklijke philips electronics n.v. 2003. all rights reserved. product data rev. 01 11 august 2003 11 of 12 contact information for additional information, please visit http://www.semiconductors.philips.com . for sales of?ce addresses, send e-mail to: sales.addresses@www.semiconductors.philips.com . fax: +31 40 27 24825 10. data sheet status [1] please consult the most recently issued data sheet before initiating or completing a design. [2] the product status of the device(s) described in this data sheet may have changed since this data sheet was published. the l atest information is available on the internet at url http://www.semiconductors.philips.com. [3] for data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. 11. de?nitions short-form speci?cation the data in a short-form speci?cation is extracted from a full data sheet with the same type number and title. for detailed information see the relevant data sheet or data handbook. limiting values de?nition limiting values given are in accordance with the absolute maximum rating system (iec 60134). stress above one or more of the limiting values may cause permanent damage to the device. these are stress ratings only and operation of the device at these or at any other conditions above those given in the characteristics sections of the speci?cation is not implied. exposure to limiting values for extended periods may affect device reliability. application information applications that are described herein for any of these products are for illustrative purposes only. philips semiconductors make no representation or warranty that such applications will be suitable for the speci?ed use without further testing or modi?cation. 12. disclaimers life support these products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. philips semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify philips semiconductors for any damages resulting from such application. right to make changes philips semiconductors reserves the right to make changes in the products - including circuits, standard cells, and/or software - described or contained herein in order to improve design and/or performance. when the product is in full production (status production), relevant changes will be communicated via a customer product/process change noti?cation (cpcn). philips semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise speci?ed. level data sheet status [1] product status [2][3] de?nition i objective data development this data sheet contains data from the objective speci?cation for product development. philips semiconductors reserves the right to change the speci?cation in any manner without notice. ii preliminary data quali?cation this data sheet contains data from the preliminary speci?cation. supplementary data will be published at a later date. philips semiconductors reserves the right to change the speci?cation without notice, in order to improve the design and supply the best possible product. iii product data production this data sheet contains data from the product speci?cation. philips semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. relevant changes will be communicated via a customer product/process change noti?cation (cpcn).
? koninklijke philips electronics n.v. 2003. printed in the netherlands all rights are reserved. reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. the information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. no liability will be accepted by the publisher for any consequence of its use. publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. date of release: 11 august 2003 document order number: 9397 750 11884 contents philips semiconductors BYV29B-600 recti?er diode ultrafast 1 product pro?le . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.2 features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 quick reference data. . . . . . . . . . . . . . . . . . . . . 1 2 pinning information . . . . . . . . . . . . . . . . . . . . . . 1 3 ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 thermal characteristics. . . . . . . . . . . . . . . . . . . 4 5.1 transient thermal impedance . . . . . . . . . . . . . . 4 6 characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 5 7 package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8 8 soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 9 revision history . . . . . . . . . . . . . . . . . . . . . . . . 10 10 data sheet status . . . . . . . . . . . . . . . . . . . . . . . 11 11 de?nitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 12 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

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